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LTC2934IDC-1 is listed in the Supervisors range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC SUPERVISOR 1 CHANNEL 8DFN. Review the specifications below when checking this part for your BOM.
The LTC2934IDC-1#TRMPBF is a voltage supervisory circuit manufactured by Analog Devices Inc. It operates within a supply voltage range of up to 5.5 V and features an adjustable threshold voltage for monitoring input signals. The device provides an open-drain output type and includes manual reset functionality. It consumes a typical operating supply current of 500 nA, ensuring ultra-low power consumption. The component offers a reset delay time of 200 ms and maintains an accuracy of 1.5%. It is housed in a DFN-8 package suitable for surface mount installation and functions across a temperature range from -40 C to +85 C.
Verify availability status as the part may be subject to limited supply or factory special orders. Confirm package type matches design requirements. Check RoHS compliance details before integration. Ensure operating temperature range aligns with environmental conditions. Validate pinout compatibility with existing PCB layout.
Choose this component when ultra-low quiescent current is critical for battery life extension. Select for designs requiring adjustable voltage thresholds rather than fixed values. Consider the DFN-8 package for space-constrained surface-mount applications. Verify that manual reset functionality meets system safety protocols. Ensure the 5.5 V maximum supply voltage covers the target application range.
This part belongs to the LTC2934 series of supervisory circuits designed for low-power monitoring tasks. It complements other Analog Devices PMIC solutions by providing precise voltage oversight with minimal energy drain. The series supports various package options including SOT-23-8 and DFN variants to accommodate different form factors.
LTC2934CTS8-1#TRPBF shares similar functional characteristics but utilizes a SOT-23-8 package instead of DFN-8. Verify footprint compatibility and thermal performance differences between packages before substitution.
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