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LTC3548IDD#PBF is listed in the Voltage Regulators - DC DC Switching Regulators range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC REG BUCK BOOST ADJ DL 10DFN. Review the specifications below when checking this part for your BOM.
The LTC3548IDD#PBF is a dual synchronous step-down DC/DC converter manufactured by Analog Devices Inc. It operates with an input voltage range of 2.5V to 5.5V and provides two independent adjustable outputs ranging from 600mV to 5V. Each channel supports up to 800mA output current, while the first channel can deliver 400mA in bypass mode. The device features a fixed switching frequency of 2.25MHz and a low quiescent current of 40µA. It is housed in a 10-lead MSOP package and is rated for operation between -40°C and +125°C.
Verify the specific suffix 'IDD' against the manufacturer's official datasheet to confirm the industrial temperature grade (-40°C to +125°C) and tape-and-reel packaging configuration. Cross-reference the part number with Analog Devices documentation to ensure compatibility with your system's thermal and electrical requirements before procurement.
Select this component when designing systems that require two isolated, adjustable low-voltage outputs from a single 3.3V or 5V source. The dual-channel architecture reduces board space compared to using separate regulators. Ensure the application load does not exceed the 800mA per channel limit and consider the 2.25MHz frequency for EMI management in sensitive environments.
This part belongs to the LTC3548 family of dual synchronous step-down converters. It shares architectural similarities with other Analog Devices PMICs but is distinct in its dual-output capability and integrated bypass feature. It serves as a compact solution for multi-rail power distribution in portable applications where efficiency and footprint are critical design constraints.
Public confirmed substitute part numbers: LTC3548EMSE#PBF (MSOP-10 package), LTC3548IUHD#PBF (DFN-10 package). Verify pinout compatibility and thermal performance differences when substituting packages.
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