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The LTC3672BEDC-1#TRMPBF is a monolithic power management IC from Analog Devices, integrating a synchronous step-down switching regulator with two low-dropout linear regulators (LDOs). The primary buck converter delivers a fixed output voltage with up to 400mA of current capability. It operates within an input voltage range of 2.5V to 5.5V and supports adjustable switching frequencies. The device incorporates two additional LDO channels, each providing 150mA output current for noise-sensitive applications. Packaged in an 8-lead WDFN exposed pad footprint, it offers high efficiency and compact board space utilization.
Verify the specific suffix #TRMPBF indicates tape and reel packaging when ordering. Confirm the fixed output voltage variant matches the design requirement, as other variants may offer adjustable outputs. Ensure thermal management considerations are addressed due to the exposed pad design in the WDFN package. Cross-reference the datasheet revision date to ensure compatibility with latest manufacturing specifications.
Select this component when a compact solution is needed for generating three distinct voltage rails from a single 3.3V or 5V source. The integrated buck regulator handles higher current loads while the LDOs provide quiet power for sensitive circuits. Evaluate the total quiescent current and load regulation requirements against the datasheet specifications to ensure system stability under varying load conditions.
This part belongs to the LTC3672 family of triple-output power management ICs designed for space-constrained applications. It combines switching and linear regulation technologies to balance efficiency and noise performance. The BEDC-1 designation specifies the fixed output voltage configuration and the specific thermal and electrical characteristics of this particular variant within the broader product line.
Direct substitutes include other LTC3672 variants with different output configurations or pin-compatible alternatives from Analog Devices such as the LTC3671 series if dual output is sufficient. Verify that any replacement maintains the same package outline dimensions and thermal dissipation capabilities to fit existing footprints without redesign.