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LTC3827EG-1#PBF is listed in the DC DC Switching Controllers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC REG CTRLR BUCK 28SSOP. Review the specifications below when checking this part for your BOM.
The LTC3827EG-1#PBF is a low quiescent current, dual-phase synchronous step-down controller manufactured by Analog Devices Inc. It operates with a fixed switching frequency of 400 kHz and supports output voltages ranging from 800 mV to 10 V. The device is designed to drive external N-channel power MOSFETs in a two-phase configuration, delivering up to 25 A per phase. It features an SSOP-28 package and functions within an operating temperature range of -40°C to +85°C. The controller draws only 80 µA of supply current during operation.
Verify the specific suffix #PBF indicates lead-free tape and reel or tube packaging as defined by Analog Devices standards. Confirm RoHS compliance status through official documentation prior to integration. Ensure the SSOP-28 footprint matches the target PCB layout requirements. Validate that the 400 kHz fixed frequency aligns with electromagnetic interference constraints in the final system design.
Select this component when a stable dual-phase solution with minimal standby power is required. The fixed 400 kHz frequency simplifies filter design compared to adjustable frequency alternatives. Consider the 25 A per phase capability against total load requirements. The SSOP-28 package offers a balance between thermal performance and board space constraints for medium-density designs.
This part belongs to the LTC3827 family of PolyPhase controllers, designed for efficient multi-phase step-down conversion. The EG-1 variant specifies the commercial temperature grade and SSOP-28 package type. It complements other devices in the series like the LTC3827EUH which utilizes a QFN package for different thermal profiles.
LTC3827EG-1#TRPBF serves as the tape and reel version of the same functional device. Direct substitution requires verifying that the packaging format change does not impact automated assembly processes. No alternative pin-compatible parts are confirmed in the provided data.
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