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LTC3850IUF#PBF is listed in the DC DC Switching Controllers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC REG CTRLR BUCK 28QFN. Review the specifications below when checking this part for your BOM.
The LTC3850IUF#PBF is a dual, two-phase synchronous step-down switching controller from Analog Devices. It drives all N-channel power MOSFET stages using a constant-frequency current mode architecture with a phase-lockable frequency up to 780kHz. The device operates within an input voltage range of 4V to 24V and supports output voltages from 800mV to 6V. It delivers up to 25A per channel with a typical static current of 30µA. Packaged in a 28-lead QFN (4mm x 5mm) for surface mount installation, it functions between -40°C and +85°C.
Verify the specific suffix #PBF confirms lead-free compliance and RoHS standards before procurement. Confirm the I-grade temperature rating (-40°C to +85°C) matches the operational environment. Ensure the QFN-28 package dimensions align with the PCB footprint design. Cross-reference the manufacturer's latest datasheet for any product change notifications or pinout updates.
Select this component when designing dual-output buck converters requiring low input ripple and high efficiency. The fixed frequency capability allows synchronization to external clocks for noise management. Consider the 25A current capability and 4V-24V input range suitability for intermediate bus architectures. Evaluate thermal performance based on the QFN package's exposed pad requirements for adequate heat dissipation.
This part belongs to the LTC3850 family of high-performance synchronous step-down controllers. It shares architectural similarities with other members like the LTC3850IGN but differs in package type and temperature grade. The IUF variant specifically denotes the industrial temperature range and QFN packaging, distinguishing it from automotive or wider input voltage variants within the broader product line.
The LTC3850IGN#PBF serves as a functional alternative offering similar control features in a narrow-body SSOP package. Designers must account for differences in thermal resistance and physical footprint when substituting components. Verify that the replacement maintains compatibility with existing gate driver requirements and feedback network configurations.
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