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LTC3862EGN-2 is listed in the DC DC Switching Controllers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC POWER MANAGEMENT. Review the specifications below when checking this part for your BOM.
The LTC3862EGN-2#PBF is a two-phase, non-synchronous boost DC/DC controller manufactured by Analog Devices Inc. It operates within an input voltage range of 5.5 V to 36 V and supports switching frequencies from 75 kHz to 500 kHz. The device utilizes peak current mode control with a fixed frequency architecture. It features clock synchronization capabilities via an external reference signal ranging from 50 kHz to 650 kHz. The controller includes a precision transconductance error amplifier for loop compensation and soft-start functionality. It is housed in a 24-pin SSOP package with exposed pad.
Verify the specific suffix against official Analog Devices documentation to confirm pinout and electrical characteristics. Ensure the selected variant matches the required gate drive voltage for the external MOSFETs. Confirm package availability and lead times through authorized distributors as supply status may vary.
Select this component for applications requiring high efficiency at elevated output voltages. The two-phase topology reduces input and output ripple currents compared to single-phase designs. Verify that the external MOSFETs are compatible with the 10V gate drive requirements specified for this variant. Consider thermal management solutions suitable for the SSOP package.
This part belongs to the LTC3862 family of PolyPhase controllers designed for high-current boost applications. The EG series variants typically feature 10V gate drivers optimized for standard power MOSFETs. The family supports flexible configuration options including phase shedding and synchronization for diverse power system architectures.
LTC3862EFE-2#PBF offers identical electrical specifications in a TSSOP-EP-24 package. LTC3862HUH-2#PBF provides the same performance in a QFN-24 package. Verify pin compatibility and thermal dissipation requirements when substituting packages.
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