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LTC3862IUH#PBF is listed in the DC DC Switching Controllers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC REG CTRLR BOOST/SEPIC 24QFN. Review the specifications below when checking this part for your BOM.
The LTC3862IUH#PBF is a multi-phase current mode step-up DC/DC controller manufactured by Analog Devices Inc. It supports Boost and SEPIC topologies with an input voltage range of 4 V to 36 V. The device operates at a switching frequency of 300 kHz and features a low quiescent current of 30 uA. Designed for industrial applications, it functions within a temperature range of -40°C to +125°C. The component is housed in a 24-lead QFN package.
Verify the specific suffix against official Analog Devices documentation to confirm pinout and thermal characteristics. Ensure compatibility with required output voltage levels before integration. Confirm RoHS compliance status through the manufacturer's latest datasheet revision. Cross-reference the package outline dimensions with PCB footprint libraries to prevent assembly errors during manufacturing.
Select this controller when designing systems requiring flexible Boost or SEPIC configurations with multiple phases. It is suitable for applications demanding low standby power consumption due to its microampere quiescent current. Consider the wide input voltage range for designs interfacing with varying battery sources or bus voltages. Evaluate thermal performance requirements given the extended industrial temperature rating.
This component belongs to the LTC3862 family of power management ICs from Analog Devices. It serves as a versatile controller for high-performance step-up converters. The family includes variants with different temperature grades and package options to suit diverse environmental constraints and space limitations in modern electronic designs.
Consult official Analog Devices substitution guides for verified alternatives. Verify that any substitute maintains identical pin assignments and control logic. Ensure thermal resistance and package dimensions match existing board layouts.
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