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LTC3870IUF-1#TRPBF is listed in the DC DC Switching Controllers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC REG CTRLR BUCK 24QFN. Review the specifications below when checking this part for your BOM.
The LTC3870IUF-1#TRPBF is a PolyPhase step-down slave controller manufactured by Analog Devices Inc. It operates with an input voltage range of 4.5V to 60V and supports switching frequencies from 100kHz to 1MHz. The device provides two outputs with adjustable voltages between 500mV and 14V, capable of supporting up to 20A output current per phase. It features clock synchronization and operates within a temperature range of -40°C to +125°C TJ. The component is housed in a 24-WFQFN package.
Verify the specific suffix #TRPBF indicates tape and reel packaging when ordering. Confirm the industrial temperature grade (I) matches your thermal requirements. Ensure compatibility with the master controller in your PolyPhase design. Check for any recent lifecycle status updates or obsolescence notices directly from Analog Devices before finalizing procurement plans.
Select this component when designing high-current buck converters requiring digital interface control. It serves as a slave controller, necessitating a compatible master IC for full functionality. Consider the 24-QFN package size for PCB layout constraints. Verify that the required output current and voltage ranges fall within the specified 500mV to 14V and 20A limits respectively.
This part belongs to the LTC3870 series, specifically the -1 variant designed for PolyPhase operations. It complements master controllers to deliver scalable power solutions. The IUF-1 designation specifies the industrial temperature range and QFN package. It is distinct from standalone regulators, functioning strictly as a controller in a multi-phase architecture.
Direct substitutes include other parts from the LTC3870 family with compatible pinouts and specifications. Verify if alternative slave controllers support the same digital interface protocols and phase count. Ensure thermal performance and package dimensions are comparable for direct replacement.
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