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LTC4227IUFD-2#PBF is listed in the Hot Swap Controllers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC HOT SWAP CTRLR GP 20QFN. Review the specifications below when checking this part for your BOM.
The LTC4227IUFD-2#PBF is a dual-channel hot swap voltage controller manufactured by Analog Devices Inc. It integrates two ideal diode controllers and one hot swap controller within a single QFN-20 package. The device supports an operating supply voltage range from 2.9V to 18V and operates at temperatures between -40°C and +85°C. Key electrical characteristics include a quiescent current of 2.5mA and adjustable current limiting capabilities. This component is designed for safe insertion and removal of circuit boards in live backplane systems.
Verify the specific suffix #PBF indicates lead-free compliance and RoHS adherence before procurement. Confirm availability status as supply may be limited or subject to factory special orders. Ensure the QFN-20 package dimensions match your PCB footprint requirements. Validate that the 2.9V to 18V supply range aligns with your system's power rails.
Select this component when dual-channel power management is required in a compact form factor. The integrated ideal diode controllers eliminate external Schottky diodes, improving efficiency. Choose this part for applications needing programmable fault protection and controlled power-up sequences. Verify thermal performance within the specified -40°C to +85°C industrial temperature range.
This part belongs to the LTC4227 series of hot swap controllers from Analog Devices. It shares functional similarities with other members like the LTC4228 but differs in channel configuration and package type. The series focuses on providing robust power distribution solutions for telecommunications and industrial equipment requiring high reliability.
Check for direct substitutes such as the LTC4227CUFD-2#PBF for commercial temperature variants. Evaluate the LTC4228 family for similar functionality with different package options. Ensure pin compatibility and parameter alignment before swapping components.
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