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LWP-C110D-007-G-19 is listed in the USB, DVI, HDMI Connector Assemblies range at ChipApex. The manufacturer field lists Linkplex. Its product description is USB 3.2 GEN 2 TYPE C 24P IPX7. Review the specifications below when checking this part for your BOM.
The Linkplex LWP-C110D-007-G-19 is a waterproof USB Type-C receptacle connector designed for high-speed data transmission. It supports the USB 3.2 Gen 2 standard, enabling data rates up to 10 Gbps. The component features 24 contacts and is rated for IPX7 ingress protection, ensuring reliability in wet environments. It utilizes a surface mount right-angle mounting configuration with horizontal orientation. The connector is built for durability, supporting 10,000 mating cycles, and operates within a temperature range of -25°C to 85°C.
Verify the specific suffix codes on the datasheet to confirm pinout compatibility and mechanical dimensions before integration. Ensure that the PCB layout accounts for the right-angle footprint and thermal requirements during soldering. Cross-reference the IPX7 rating with actual application exposure levels to confirm suitability for long-term submersion scenarios.
Select this component when both high-speed data connectivity and environmental sealing are required simultaneously. It is suitable for applications where standard USB-C connectors would fail due to liquid exposure. Consider the right-angle form factor if space constraints prevent straight-through cable routing. Validate that the 24-pin configuration matches the host controller's signal requirements.
This part belongs to Linkplex's specialized line of waterproof USB Type-C connectors. It addresses the growing demand for durable interfaces in harsh environments. The series distinguishes itself by combining standard USB specifications with advanced sealing technologies. This specific model represents a solution for integrating modern USB standards into ruggedized hardware designs.
Direct substitutes must match the 24-pin count, USB 3.2 Gen 2 speed rating, and IPX7 protection level. Verify mechanical compatibility regarding the right-angle surface mount footprint. Check for equivalent current ratings and operating temperature ranges to ensure functional parity without redesigning the enclosure.
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