Microprocessors LX2162RE82029B product image

LX2162RE82029B

$311.76
  • Description:IC MPU QORIQ LX 2GHZ 1150FBGA
  • Series:QorIQ LX
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:384af02ab87f Category: Brand:

  
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LX2162RE82029B is listed in the Microprocessors range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MPU QORIQ LX 2GHZ 1150FBGA. Review the specifications below when checking this part for your BOM.

Microprocessors specifications for LX2162RE82029B

  • Description:IC MPU QORIQ LX 2GHZ 1150FBGA
  • Series:QorIQ LX
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:ARM® Cortex®-A72
  • Number of Cores/Bus Width:16 Core, 64-Bit
  • Speed:2GHz
  • Co-Processors/DSP:-
  • RAM Controllers:DDR4, SDRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:SATA 6Gbps (4)
  • USB:USB 3.0 (1)
  • Voltage - I/O:-
  • Operating Temperature:5°C ~ 105°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:1150-FBGA
  • Supplier Device Package:1150-FBGA (23x23)
  • Additional Interfaces:CANbus, I2C, PCIe, SPI, UART

Microprocessors datasheet and documents for LX2162RE82029B

LX2162RE82029B

Microprocessors Overview

The NXP LX2162RE82029B is a Layerscape LX2162A integrated multicore processor featuring sixteen Arm Cortex-A72 cores operating up to 2.0 GHz. It utilizes the DPAA2 architecture with an 8 MB Level 3 cache and supports DDR4 SDRAM via one 72-bit controller. The device includes twelve SerDes lanes, three PCIe Gen3 controllers (x8, x4, x4), and up to fourteen Ethernet MACs supporting speeds from 1G to 50G. Additional interfaces include USB 3.0, CAN-FD, FlexSPI, SPI, I2C, UART, and GPIO.

Microprocessors Feature Summary

  • DPAA2 datapath acceleration architecture providing hardware packet parsing, classification, distribution, and queue management
  • Integrated security acceleration engine supporting cryptography at high throughput rates
  • Hardware virtualization support through Arm MMU-500 for partitioning enforcement
  • Comprehensive connectivity including multiple high-speed serial lanes and diverse peripheral buses

Microprocessors Applications

  • Networking infrastructure equipment
  • Telecom and datacom systems
  • Wireless infrastructure base stations
  • Mil/aerospace applications

Microprocessors Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to confirm package type, temperature range, and feature configuration. Ensure compliance with export control regulations as indicated in distributor documentation. Confirm that the selected variant matches the required pinout and electrical specifications for the target design.

Microprocessors Selection Notes

Select this component for designs requiring high core counts and extensive network interface density. Evaluate the need for the specific SerDes lane count and PCIe controller configuration relative to system bandwidth requirements. Consider the thermal characteristics of the FC-PBGA package and ensure adequate cooling solutions are implemented for sustained operation.

Microprocessors Part Context

This part belongs to the NXP Layerscape LX2 series, which also includes the LX2122A and LX2082A variants. These processors share a common software API and architectural foundation but differ in core count and cache size. The LX2162A represents the highest performance tier within this specific generation, offering sixteen cores compared to twelve or eight in other models.

Microprocessors Replacement Considerations

LX2122A, LX2082A

LX2162RE82029BLX2162RE82029B
$311.76
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