LX64EV-5F100I

LX64EV-5F100I

  • Description:IC FPGA 64 I/O 100FBGA
  • Series:ispGDX2™
  • Mfr:Lattice Semiconductor Corporation
  • Package:Tray

SKU:2d2b47fcbe87 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IC FPGA 64 I/O 100FBGA
  • Series:ispGDX2™
  • Mfr:Lattice Semiconductor Corporation
  • Package:Tray
  • Type:-
  • Circuit:-
  • Independent Circuits:-
  • Current - Output High, Low:-
  • Voltage Supply Source:-
  • Voltage - Supply:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-FPBGA (11x11)
  • Grade:-
  • Qualification:-

Download product information

LX64EV-5F100I

Overview

The Lattice LX64EV-5F100I is a member of the LatticeECP3 FPGA family, featuring 67K logic cells (LUTs) and 240 Embedded Block RAM (EBR) SRAM blocks. It includes 12 high-speed SERDES channels capable of 3.2 Gbps operation and supports DDR3/DDR2/DDR memory interfaces. The device operates at a 1.2V core voltage and utilizes external boot flash with dual-boot capability. It is housed in a 100-pin Fine Pitch Ball Grid Array (FPBGA) package.

Feature Summary

  • Integrates up to 16 high-speed SERDES channels for advanced connectivity protocols
  • Supports multiple memory standards including DDR3, DDR2, and DDR
  • Features on-chip security mechanisms such as bitstream encryption

Applications

  • Industrial infrastructure equipment
  • Telecom base station components
  • Automotive sensor processing systems

Procurement Notes

Verify the specific suffix 'EV' against official Lattice documentation to confirm if it denotes an engineering validation sample or a specific temperature grade variant. Ensure the 'I' suffix corresponds to the industrial temperature range (-40°C to +85°C). Confirm package availability and pinout compatibility with existing PCB footprints before procurement.

Selection Notes

Select this component when design requirements exceed the capacity of smaller ECP3 devices but do not necessitate the larger 150K LUT models. It offers a balance of logic density and I/O flexibility. Consider the 100-ball FPBGA package constraints regarding board space and thermal dissipation capabilities relative to the target application's power budget.

Part Context

This part belongs to the LatticeECP3 series, designed for cost-sensitive applications requiring low power consumption and small form factors. The series targets markets demanding reliable signal processing and interface bridging with minimal energy usage, distinguishing it from higher-performance families like CertusPro-NX.

Replacement Considerations

Direct substitutes within the same family include the ECP3-95 or ECP3-150 for increased resources, or the ECP3-35 for reduced footprint. Cross-family migration requires verification of pin compatibility and toolchain support.

LX64EV-5F100ILX64EV-5F100I

Click on the inquiry