M100PF-2AC

Overview

The M100PF-2AC is a PolarFire System-on-Module by ARIES Embedded, built on the Microchip MPF200T FPGA. It measures 74.00mm x 42.00mm with a 360-pin interface. The module integrates 1GB of LPDDR4 and 4GB of eMMC storage. It supports 12.7G transceivers and operates within a temperature range of 0°C to 70°C. The design offers reduced power consumption compared to competing mid-range solutions while providing substantial logic capacity.

Feature Summary

• Integrates PolarFire SoC FPGA with high-density logic elements
• Includes dedicated memory for host and hypervisor management
• Features dual Gigabit Ethernet connectivity
• Provides multiple serial communication ports including CAN and RS232

Applications

• Industrial automation control systems
• Embedded networking infrastructure
• Medical device processing units
• Transportation telematics modules

Procurement Notes

Verify that the specific suffix indicates the required memory configuration. Confirm the operating temperature range matches your environmental requirements. Ensure carrier board compatibility with the 360-pin connector pitch. Request official datasheets to validate pinout assignments before integration.

Selection Notes

Choose this module when compact form factor is critical alongside moderate FPGA resources. It suits applications requiring integrated storage and network interfaces without external components. Consider the power efficiency benefits for battery-constrained or thermally limited designs. Evaluate the I/O availability against specific sensor and actuator requirements.

Part Context

This module belongs to the M100PF family, which scales from 100K to 300K logic elements. The series utilizes Microchip's PolarFire technology for low-power operation. Other variants in the line may offer different memory capacities or extended temperature ranges. The family targets embedded applications needing FPGA flexibility with system-level integration.

Replacement Considerations

Direct substitutes include other M100PF variants with adjusted memory sizes. Cross-reference pinouts with similar ARIES Embedded modules. Verify logical equivalence if migrating from older FPGA generations. Check mechanical dimensions against existing carrier board footprints.