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M20-8761746 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Harwin Inc.. Its product description is CONN HEADER SMD 34POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Harwin M20-8761746 is a surface mount pin header from the M20 series, featuring 34 positions with a 2.54 mm pitch. It utilizes a single row configuration and straight orientation for board-to-board or wire-to-board connections. The connector employs solder termination and tin-plated contacts housed in a nylon insulator. Designed for automated pick-and-place assembly, it supports a mating pin length of 5.8 mm and operates within a temperature range of -40°C to 105°C.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and specific plating variants prior to procurement. Ensure storage conditions maintain integrity of the nylon housing and contact surfaces. Validate that the selected variant matches the required 34-position count and surface mount specifications for your application.
Select this component when a high-density single-row surface mount header is required. The 2.54 mm pitch accommodates standard PCB layouts while the 34-position count provides extensive I/O capabilities. Consider the straight orientation and SMT profile for space-constrained designs where automated assembly efficiency is prioritized over manual placement flexibility.
This part belongs to the Harwin M20 series, which offers a comprehensive range of headers and wire housings. The series is characterized by its versatility in providing both through-hole and surface mount options across various position counts. The M20-8761746 specifically addresses the need for high-pin-count surface mount solutions within this established product family.
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing footprints and mating connectors before considering alternative sources.
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