M20-9722746

Headers, Male Pins Overview

The M20-9722746 is a Harwin M20 series board-to-board connector featuring 54 positions in a dual-row configuration. It utilizes a 2.54 mm (0.1 inch) pitch and is designed for vertical through-hole soldering. The component functions as a pin header with male contacts, suitable for high-density PCB applications requiring robust mechanical stability and reliable electrical interconnection.

Headers, Male Pins Feature Summary

• Dual-row pin header design for compact board-to-board connectivity
• Vertical orientation optimized for standard PCB mounting profiles
• Through-hole termination ensures secure mechanical anchoring

Headers, Male Pins Applications

• High-density electronic assembly interconnections
• Industrial control system board linking
• Telecommunications equipment internal connections

Headers, Male Pins Procurement Notes

Verify the specific contact plating finish and insulation material grade against project requirements before ordering. Confirm that the vertical height and mating partner dimensions align with the target PCB stack-up to ensure proper engagement without mechanical interference during assembly.

Headers, Male Pins Selection Notes

Select this component when a 54-position vertical interface is required within the M20 family ecosystem. Ensure compatibility with mating receptacles sharing the same 2.54 mm pitch and dual-row geometry. Validate thermal resistance capabilities against peak soldering temperatures encountered during manufacturing processes.

Headers, Male Pins Part Context

This part belongs to the Harwin M20 series, a widely adopted industrial standard connector line. The series emphasizes durability and precision for demanding environments. The M20-9722746 specifically addresses needs for higher channel counts in vertical configurations while maintaining the series' established footprint and performance characteristics.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 54-position count, 2.54 mm pitch, and vertical through-hole form factor. Verify identical housing material properties and contact current ratings to maintain system integrity. Cross-reference with other manufacturers offering equivalent DIL headers if supply constraints exist.