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M20-9951345 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Harwin Inc.. Its product description is CONN HEADER R/A 26POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Harwin M20-9951345 is a vertical pin header connector from the M20 series, designed for through-hole mounting. It features a 2.54mm pitch and a single row configuration with 13 positions. The contacts are made of copper alloy with gold plating to ensure reliable signal transmission. The housing is constructed from high-temperature polyamide rated UL 94 V-0. This component supports board-to-board or cable-to-board connections, operating within a temperature range of -40°C to +105°C.
Verify the specific ordering suffix to confirm contact plating and housing color variants. Ensure compatibility with mating socket specifications regarding current rating and voltage withstand. Confirm that the single-row latching style matches the mechanical requirements of the target assembly before finalizing procurement orders.
Select this part when a single-row, vertically oriented header with a latching feature is required. The 2.54mm pitch suits standard commercial and industrial PCB layouts. Consider the high-temperature housing rating for environments exceeding standard thermal limits. Verify that the 13-position count aligns precisely with the circuit trace requirements.
This component belongs to the Harwin M20 series, which offers versatile connectivity solutions. The M20-9951345 specifically represents the single-row variant with latching functionality. It complements other M20 series products that may feature double-row configurations or jackscrew fixing options, providing designers with flexible interconnect choices.
Direct substitutes within the M20 series include M20-9951346, which differs in housing color or plating finish. Other compatible parts must maintain the 2.54mm pitch, single-row layout, and through-hole termination method to ensure mechanical and electrical interchangeability without redesigning the PCB footprint.
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