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— IC芯片 | 连接器 | 传感器 | 被动器件 —
M24SR02-YMN6T/2 is listed in the RFID, RF Access, Monitoring ICS range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IC RFID TRANSP 13.56MHZ 8SO. Review the specifications below when checking this part for your BOM.
The M24SR02-YMN6T/2 is a dynamic NFC/RFID tag IC from the ST25 family, featuring a dual interface with an embedded 2-kbit (256-byte) EEPROM. It supports I2C serial communication at up to 1 MHz and contactless operation via a 13.56 MHz RF interface compliant with ISO/IEC 14443 Type A and NFC Forum Type 4 Tag standards. The device operates on a single supply voltage ranging from 2.7 V to 5.5 V and includes a 7-byte unique identifier and 128-bit password protection. It is housed in an 8-lead SOIC package.
Verify the specific suffix MN6T/2 corresponds to the SOIC-8 package variant when sourcing. Confirm RoHS compliance status through official manufacturer documentation. Ensure compatibility with system voltage levels within the 2.7 V to 5.5 V range. Check for latest revision updates in the datasheet to confirm pinout and electrical characteristics remain unchanged.
Select this component when a small form factor dynamic tag with integrated memory is required. It is suitable for applications needing both local I2C programming and remote NFC reading. Consider the SOIC-8 package for standard surface-mount assembly processes. Evaluate the need for ISO 14443 Type A compatibility against other NFC standards if interacting with specific reader ecosystems.
This part belongs to the M24SR02-Y series within STMicroelectronics' ST25 family of NFC/RFID solutions. It serves as a dynamic tag IC designed for secure data storage and exchange. The family offers various package options, with the MN6T/2 variant specifically denoting the SOIC-8 footprint. It complements reader ICs in complete NFC ecosystem designs.
Direct replacements include other M24SR02-Y variants with different packages such as M24SR02-YMC6T/2 (UFDFPN-8) or M24SR02-YMS6T/2 (TSSOP-8). Verify that the substitute package matches the PCB footprint and thermal requirements. Ensure the functional specifications and protocol support remain identical for seamless integration.
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