Memory IC M29F800FT55N3E2 product image

M29F800FT55N3E2

  • Description:IC FLASH 8MBIT PARALLEL 48TSOP I
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:086f3c730aae Category: Brand:

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M29F800FT55N3E2 is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 8MBIT PARALLEL 48TSOP I. Review the specifications below when checking this part for your BOM.

Memory IC specifications for M29F800FT55N3E2

  • Description:IC FLASH 8MBIT PARALLEL 48TSOP I
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:8Mbit
  • Memory Organization:1M x 8, 512K x 16
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:55ns
  • Voltage - Supply:4.5V ~ 5.5V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-TFSOP (0.724", 18.40mm Width)
  • Supplier Device Package:48-TSOP I
  • Access Time:55 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for M29F800FT55N3E2

M29F800FT55N3E2

Memory IC Overview

The M29F800FT55N3E2 is an 8-Mbit parallel NOR flash memory device manufactured by Alliance Memory, originally based on Micron Technology designs. It features a TSOP-48 surface-mount package and supports asynchronous access with a maximum speed of 55 ns. The device operates within a voltage range of 4.5 V to 5.5 V and offers flexible data bus configurations of either 1 M x 8 or 512 K x 16 bits. It is rated for extended industrial temperature ranges from -40°C to +125°C and utilizes top boot block architecture for efficient code execution.

Memory IC Feature Summary

  • Supports fast read access times suitable for direct code execution applications
  • Features top boot block configuration for reliable firmware storage
  • Provides flexible 8-bit or 16-bit data bus width options
  • Operates reliably across extended industrial temperature environments

Memory IC Applications

  • Embedded systems requiring direct code execution (XIP)
  • Industrial control units with strict temperature requirements
  • Consumer electronics firmware storage
  • Automotive electronic modules

Memory IC Procurement Notes

Verify the manufacturer designation carefully, as this component may be sourced under Alliance Memory branding despite its Micron heritage. Confirm the specific suffix N3E2 matches your environmental and packaging requirements. Ensure compatibility with existing board layouts for the TSOP-48 footprint. Check for moisture sensitivity levels if reflow soldering is required. Validate that the 55 ns access time meets your system's timing constraints.

Memory IC Selection Notes

Select this component when high-speed parallel access is necessary for code execution in space-constrained designs. The TSOP-48 package offers a compact solution compared to larger PLCC or BGA alternatives. Consider the 55 ns speed for systems requiring rapid instruction fetch cycles. The extended temperature range makes it suitable for harsh environments where standard commercial grade parts would fail. Verify power supply stability within the 4.5 V to 5.5 V window.

Memory IC Part Context

This part belongs to the M29F series of parallel NOR flash memories, widely used for storing executable code in embedded devices. The series is known for its reliability and support for both 8-bit and 16-bit interfaces. While originally developed by Micron, production and branding have transitioned to Alliance Memory, maintaining technical continuity for legacy designs.

Memory IC Replacement Considerations

Direct substitutes include the M29F800FT55N3E1 variant, which shares identical electrical characteristics but may differ in packaging or environmental ratings. Other compatible parts within the M29F800 family should be evaluated for pin compatibility and timing specifications before substitution.

M29F800FT55N3E2M29F800FT55N3E2

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