Soc System On Chip M2S025-VFG256 product image

M2S025-VFG256

$62.47
  • Description:IC SOC CORTEX-M3 166MHZ 256FBGA
  • Series:SmartFusion®2

SKU:f003c14ad1a7 Category: Brand:

  
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M2S025-VFG256 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 256FBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for M2S025-VFG256

  • Description:IC SOC CORTEX-M3 166MHZ 256FBGA
  • Series:SmartFusion®2
  • Mfr:Microchip Technology
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:ARM® Cortex®-M3
  • Flash Size:256KB
  • RAM Size:64KB
  • Peripherals:DDR, PCIe, SERDES
  • Connectivity:CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Speed:166MHz
  • Primary Attributes:FPGA - 25K Logic Modules
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)

Soc System On Chip datasheet and documents for M2S025-VFG256

M2S025-VFG256

Soc System On Chip Overview

The M2S025-VFG256 is a SmartFusion® 2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM Cortex-M3 microcontroller subsystem with a 4-input LookUp Table (LUT) based FPGA fabric containing 27,696 logic elements. The device features 256 KB of program memory and 64 KB of data RAM. Key peripherals include Ethernet, USB, CANbus, I2C, SPI, UART/USART, PCIe, SERDES, and DDR interfaces. It operates at a maximum clock frequency of 166 MHz within a 256-pin VFQFPN package.

Soc System On Chip Feature Summary

  • Integrated ARM Cortex-M3 processor core operating up to 166 MHz
  • 27,696 Logic Elements (LEs) in the FPGA fabric
  • Embedded nonvolatile memory: 256 KB Program Memory, 64 KB Data RAM
  • High-speed serial interfaces including PCIe Gen 2 and SERDES

Soc System On Chip Applications

  • Industrial automation controllers requiring real-time processing
  • Secure communication gateways utilizing integrated encryption blocks
  • Automotive infotainment systems leveraging CANbus and Ethernet connectivity
  • Medical imaging equipment requiring low-power high-density logic

Soc System On Chip Procurement Notes

Verify the specific temperature grade suffix (e.g., 'I' for Industrial or absence for Commercial) against the required operating junction temperature range. Confirm the package outline matches the 256-lead Fine-Pitch Ball Grid Array (FPBGA) dimensions. Ensure design files align with the SmartTime timing model for the selected speed grade.

Soc System On Chip Selection Notes

Select this component when a combined MCU and FPGA solution is needed to reduce board space. Compare logic density requirements against the 27K LE capacity. Verify that the available I/O count supports the peripheral interface needs. Consider thermal resistance values if operating near the maximum junction temperature limits.

Soc System On Chip Part Context

This part belongs to the SmartFusion® 2 family, which bridges the gap between traditional MCUs and FPGAs. It utilizes Microchip's flash-based technology, allowing for instant-on functionality without external configuration memory. The VFG256 suffix denotes the specific 256-pin ball grid array package variant used in compact form-factor designs.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other densities in the SmartFusion 2 series, such as M2S010 or M2S050 variants, provided the logic resources meet the design constraints. Cross-family migration to IGLOO 2 requires significant architectural adjustments due to the absence of the integrated MSS.

M2S025-VFG256M2S025-VFG256
$62.47
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