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M2S025T-1FCS325I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 325BGA. Review the specifications below when checking this part for your BOM.
The M2S025T-1FCS325I is a SmartFusion 2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM Cortex-M3 microcontroller subsystem with a 27,696-logic element FPGA fabric in a 325-ball FCBGA package. The device operates at a maximum frequency of 166 MHz and supports industrial temperature ranges from -40°C to +100°C. Key electrical parameters include a core supply voltage (VDD) of 1.2V nominal (range 1.14V–1.26V) and I/O bank voltages supporting standards from 1.2V to 3.3V.
Verify the specific suffix 'I' confirms the industrial temperature range (-40°C to +100°C). Confirm the package type FCS325 corresponds to the 11mm x 11mm Fine Pitch Ball Grid Array. Ensure design tools support the SmartFusion 2 family for proper timing closure using SmartTime.
Select this model when both MCU processing and reconfigurable logic are required in a single chip. Compare against IGLOO 2 devices if only FPGA fabric is needed without the integrated Cortex-M3 subsystem. Verify that the 27KLE density meets logic requirements and that the 325-pin package provides sufficient I/O count for the interface needs.
This component belongs to the SmartFusion 2 family, which bridges the gap between traditional MCUs and FPGAs. It is part of Microchip's mainstream SoC FPGA portfolio, designed for applications needing secure, low-power, and reliable embedded solutions. The '025' designation indicates the specific logic density tier within the series.
Direct pin-to-pin replacements within the same package may include other densities in the SmartFusion 2 series such as M2S010 or M2S050 variants, provided logic resources are sufficient. Cross-family migration to IGLOO 2 requires software adaptation as the MCU subsystem is absent.
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