Soc System On Chip M2S025T-1FCS325I product image

M2S025T-1FCS325I

$76.93
  • Description:IC SOC CORTEX-M3 166MHZ 325BGA
  • Series:SmartFusion®2

SKU:b9a498abefe2 Category: Brand:

  
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M2S025T-1FCS325I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 325BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for M2S025T-1FCS325I

  • Description:IC SOC CORTEX-M3 166MHZ 325BGA
  • Series:SmartFusion®2
  • Mfr:Microchip Technology
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:ARM® Cortex®-M3
  • Flash Size:256KB
  • RAM Size:64KB
  • Peripherals:DDR, PCIe, SERDES
  • Connectivity:CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Speed:166MHz
  • Primary Attributes:FPGA - 25K Logic Modules
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:325-TFBGA, FCBGA
  • Supplier Device Package:325-FCBGA (11x11)

Soc System On Chip datasheet and documents for M2S025T-1FCS325I

M2S025T-1FCS325I

Soc System On Chip Overview

The M2S025T-1FCS325I is a SmartFusion 2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM Cortex-M3 microcontroller subsystem with a 27,696-logic element FPGA fabric in a 325-ball FCBGA package. The device operates at a maximum frequency of 166 MHz and supports industrial temperature ranges from -40°C to +100°C. Key electrical parameters include a core supply voltage (VDD) of 1.2V nominal (range 1.14V–1.26V) and I/O bank voltages supporting standards from 1.2V to 3.3V.

Soc System On Chip Feature Summary

  • Integrates ARM Cortex-M3 processor with 256KB Flash and 64KB RAM alongside 27,696 logic elements
  • Supports high-speed peripherals including PCIe Gen 2, DDR3 memory controller, and multiple SerDes lanes
  • Industrial temperature grade (-40°C to +100°C) with 20-year data retention
  • Low-power flash technology providing non-volatile configuration without external boot memory

Soc System On Chip Applications

  • Secure industrial control systems requiring real-time processing and FPGA flexibility
  • Embedded networking applications utilizing integrated Ethernet and USB interfaces
  • Automotive and aerospace electronics demanding high reliability and radiation tolerance features
  • Test and measurement equipment requiring precise timing and mixed-signal capabilities

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature range (-40°C to +100°C). Confirm the package type FCS325 corresponds to the 11mm x 11mm Fine Pitch Ball Grid Array. Ensure design tools support the SmartFusion 2 family for proper timing closure using SmartTime.

Soc System On Chip Selection Notes

Select this model when both MCU processing and reconfigurable logic are required in a single chip. Compare against IGLOO 2 devices if only FPGA fabric is needed without the integrated Cortex-M3 subsystem. Verify that the 27KLE density meets logic requirements and that the 325-pin package provides sufficient I/O count for the interface needs.

Soc System On Chip Part Context

This component belongs to the SmartFusion 2 family, which bridges the gap between traditional MCUs and FPGAs. It is part of Microchip's mainstream SoC FPGA portfolio, designed for applications needing secure, low-power, and reliable embedded solutions. The '025' designation indicates the specific logic density tier within the series.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package may include other densities in the SmartFusion 2 series such as M2S010 or M2S050 variants, provided logic resources are sufficient. Cross-family migration to IGLOO 2 requires software adaptation as the MCU subsystem is absent.

M2S025T-1FCS325IM2S025T-1FCS325I
$76.93
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