Soc System On Chip M2S025TS-FCSG325 product image

M2S025TS-FCSG325

$69.24
  • Description:IC SOC CORTEX-M3 166MHZ 325BGA
  • Series:SmartFusion®2

SKU:99ce94b586f4 Category: Brand:

  
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M2S025TS-FCSG325 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 325BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for M2S025TS-FCSG325

  • Description:IC SOC CORTEX-M3 166MHZ 325BGA
  • Series:SmartFusion®2
  • Mfr:Microchip Technology
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:ARM® Cortex®-M3
  • Flash Size:256KB
  • RAM Size:64KB
  • Peripherals:DDR, PCIe, SERDES
  • Connectivity:CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Speed:166MHz
  • Primary Attributes:FPGA - 25K Logic Modules
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:325-TFBGA, FCBGA
  • Supplier Device Package:325-FCBGA (11x11)

Soc System On Chip datasheet and documents for M2S025TS-FCSG325

M2S025TS-FCSG325

Soc System On Chip Overview

The M2S025TS-FCSG325 is a SmartFusion® 2 System-on-Chip FPGA from Microchip Technology, featuring an ARM Cortex-M3 processor and 27.6K logic elements. It operates within a junction temperature range of -40°C to 100°C (Industrial) or 0°C to 85°C (Commercial). The core supply voltage (VDD) is nominally 1.2V, with charge pump voltages (VPP/VPPNVM) at 2.5V or 3.3V. Quiescent current typically ranges from 3.7mA to 41.0mA depending on mode and temperature. The device utilizes a 325-ball FCBGA package.

Soc System On Chip Feature Summary

  • Integrates ARM Cortex-M3 microcontroller subsystem with 27.6K FPGA logic elements
  • Supports Industrial (-40°C to 100°C) and Commercial (0°C to 85°C) temperature grades
  • Features low-power flash technology with 20-year data retention
  • Includes embedded nonvolatile memory (eNVM) and SRAM

Soc System On Chip Applications

  • Secure industrial control systems requiring real-time processing
  • Low-power IoT gateways and edge computing nodes
  • Military and aerospace applications utilizing radiation-tolerant flash technology
  • Embedded systems integrating mixed-signal I/O and high-speed serial interfaces

Soc System On Chip Procurement Notes

Verify the specific suffix 'TS' indicates the Data Security density variant as per Table 1-2. Confirm the speed grade '-1' matches design timing requirements using SmartTime tools. Ensure power delivery networks support VDD at 1.2V and VPP at 2.5V or 3.3V depending on programming conditions. Check for export control classifications such as ECCN 3A991D if applicable.

Soc System On Chip Selection Notes

Select this model for designs requiring integrated MCU capabilities alongside FPGA fabric. The 'TS' designation specifies the security density level; verify against Table 1-2 for appropriate encryption features. Choose between Commercial and Industrial temperature grades based on environmental constraints. Ensure thermal management accounts for θJA values provided in Table 3-7 for the FCS325 package.

Soc System On Chip Part Context

This component belongs to the SmartFusion® 2 family, which combines Flash*Freeze FPGA technology with a Microcontroller Subsystem. It differs from IGLOO 2 devices by including the ARM Cortex-M3 core and rich peripheral set like Ethernet and USB. The part number prefix M2S identifies it as a SmartFusion 2 SoC FPGA rather than a standalone FPGA.

Soc System On Chip Replacement Considerations

Direct replacements within the same family include M2S025T-FCSG325 (non-security density) or M2S050TS-FCSG325 (higher density). Verify pinout compatibility and ensure the replacement supports the required operating temperature range and security features defined in Table 1-2.

M2S025TS-FCSG325M2S025TS-FCSG325
$69.24
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