M2S050T-FGG896

Soc System On Chip Overview

The M2S050T-FGG896 is a SmartFusion® 2 System-on-Chip FPGA from Microchip Technology, integrating an ARM Cortex-M3 microcontroller subsystem with a 50K logic element FPGA fabric. It utilizes low-power flash technology for non-volatile configuration and features embedded memory blocks, high-performance SerDes interfaces, and hard DDR3 controllers. The device supports industrial operating temperatures ranging from -40°C to 100°C junction temperature. Key electrical specifications include a core supply voltage (VDD) of 1.14V to 1.26V and I/O bank voltages supporting standards from 1.14V to 3.3V. The component is housed in an 896-ball FBGA package.

Soc System On Chip Feature Summary

• Integrates ARM Cortex-M3 MSS with Ethernet, USB, and CAN peripherals alongside 56,340 logic elements
• Features up to 16 SerDes lanes and hard DDR3 memory controllers with error correction
• Utilizes industry-leading low-power flash technology for instant-on operation and high security
• Supports multiple I/O standards including LVDS, PCIe Gen 2, and various differential signaling types

Soc System On Chip Applications

• Industrial automation and control systems requiring real-time processing
• Secure communication infrastructure utilizing integrated encryption and SerDes
• Test and measurement equipment needing mixed-signal FPGA capabilities
• Automotive electronics compliant with strict thermal and reliability standards

Soc System On Chip Procurement Notes

Verify the specific temperature grade suffix (e.g., 'I' for Industrial) matches the required operational environment. Confirm package availability as manufacturing status may change; check official Microchip documentation for current production status and lead times. Ensure compliance with RoHS and REACH regulations relevant to the target market.

Soc System On Chip Selection Notes

Select this model for applications requiring both MCU processing and FPGA flexibility within a single chip. Consider the 896-pin package size for board layout constraints. Evaluate power consumption against the thermal resistance data provided in the datasheet to ensure junction temperatures remain within limits under maximum load conditions.

Soc System On Chip Part Context

This part belongs to the SmartFusion® 2 family, which bridges the gap between traditional MCUs and FPGAs. It shares architectural similarities with IGLOO® 2 FPGAs but adds the integrated MSS. The '050' designation indicates approximately 50K logic elements, while 'FGG896' specifies the 896-ball FineLine BGA package type.

Soc System On Chip Replacement Considerations

Direct replacements within the same density and package are limited due to specific pinouts. Upgrades may involve moving to higher density parts like M2S150 series if resources allow, or migrating to newer families such as PolarFire or Igloo2 if feature sets permit. Verify pin compatibility and software toolchain support before substitution.