M2S060T-1FCS325I

Soc System On Chip Overview

The M2S060T-1FCS325I is a SmartFusion 2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM Cortex-M3 microcontroller subsystem with a 4-input LookUp Table-based FPGA fabric containing 56,520 logic elements. The device operates within a junction temperature range of -40°C to 100°C and utilizes a 325-ball Fine-pitch Column Ball Grid Array (FCBGA) package. Key electrical specifications include a DC core supply voltage (VDD) ranging from 1.14 V to 1.26 V, with typical operation at 1.2 V. The architecture supports embedded memory blocks, high-speed serial interfaces, and industry-standard peripherals.

Soc System On Chip Feature Summary

• Integrates an ARM Cortex-M3 processor running up to 166 MHz with 256 KB program memory and 64 KB data RAM.
• Contains 56,520 Logic Elements (LEs) for complex digital logic implementation.
• Features a 325-ball FCBGA package suitable for surface-mount applications.
• Supports industrial operating temperatures from -40°C to +100°C.

Soc System On Chip Applications

• Industrial automation controllers requiring real-time processing and secure boot.
• Automotive infotainment systems utilizing integrated Ethernet and USB peripherals.
• Aerospace and defense avionics leveraging flash-based non-volatile configuration.
• Medical imaging equipment requiring low-power, high-reliability programmable logic.

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +100°C). Confirm the package type is FCBGA-325. Check for export control requirements as indicated in distributor listings. Ensure compatibility with SmartTime timing analysis tools for the selected speed grade.

Soc System On Chip Selection Notes

Select this model when a combined MCU and FPGA solution is required within the 50K-60K logic density range. Compare against the IGLOO 2 family if a pure FPGA without an embedded processor is sufficient. Verify that the 166 MHz maximum clock frequency meets system timing requirements. Consider thermal resistance values for heat dissipation in enclosed environments.

Soc System On Chip Part Context

This component belongs to the SmartFusion 2 family, which bridges the gap between traditional MCUs and FPGAs. It shares architectural similarities with the IGLOO 2 series but includes the additional Microcontroller Subsystem (MSS). The 'T' suffix typically denotes a specific temperature or security variant within the broader SmartFusion 2 product line.

Soc System On Chip Replacement Considerations

Direct replacements within the same package and pinout include other densities in the SmartFusion 2 series such as M2S050T-1FCS325I or M2S090-1FCSG325, provided logic resources are adequate. Cross-family migration to IGLOO 2 requires removing the ARM core dependency.