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M2S060T-1FCSG325 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 325BGA. Review the specifications below when checking this part for your BOM.
The M2S060T-1FCSG325 is a SmartFusion® 2 System-on-Chip FPGA from Microchip Technology, featuring an ARM Cortex-M3 microcontroller subsystem integrated with a 4-input LookUp Table (LUT) based FPGA fabric. It provides up to 60K logic elements and supports industrial operating temperatures ranging from -40°C to 100°C. The device utilizes low-power flash technology for non-volatile configuration and includes embedded memory blocks, high-performance SerDes interfaces, and hard DDR3 controllers. Key electrical specifications include a DC core supply voltage (VDD) of 1.14V to 1.26V and a charge pump supply (VPP) of 2.375V to 3.45V depending on the range.
Verify the specific speed grade suffix '1' corresponds to the required timing performance for your design. Confirm that the FCSG325 package dimensions align with your PCB footprint requirements. Ensure power supply rails meet the recommended operating conditions specified in the datasheet, particularly VDD and VPP ranges for industrial temperature operation.
Select this model when a combination of MCU processing and FPGA flexibility is needed within the SmartFusion 2 family. Compare against IGLOO 2 devices if only FPGA functionality without an integrated MCU is sufficient. Consider thermal resistance values provided in the datasheet to ensure adequate heat dissipation for the chosen application environment.
This component belongs to the SmartFusion 2 SoC FPGA family, which bridges the gap between traditional MCUs and FPGAs. It shares architectural similarities with the IGLOO 2 FPGA series but adds the Microcontroller Subsystem (MSS). The 'T' designation indicates a specific density variant within the 060 class, offering a balance of logic resources and I/O count for mid-range applications.
Direct replacements within the same package and pinout may include other densities in the SmartFusion 2 series such as M2S090TS or M2S050TS, subject to logic resource availability. Cross-family migration to IGLOO 2 requires removing MCU dependencies and adapting the FPGA fabric constraints.
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