Soc System On Chip M2S060T-1FGG676 product image

M2S060T-1FGG676

$147.13
  • Description:IC SOC CORTEX-M3 166MHZ 676FBGA
  • Series:SmartFusion®2

SKU:0493e0997737 Category: Brand:

  
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M2S060T-1FGG676 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 676FBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for M2S060T-1FGG676

  • Description:IC SOC CORTEX-M3 166MHZ 676FBGA
  • Series:SmartFusion®2
  • Mfr:Microchip Technology
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:ARM® Cortex®-M3
  • Flash Size:256KB
  • RAM Size:64KB
  • Peripherals:DDR, PCIe, SERDES
  • Connectivity:CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Speed:166MHz
  • Primary Attributes:FPGA - 60K Logic Modules
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:676-BGA
  • Supplier Device Package:676-FBGA (27x27)

Soc System On Chip datasheet and documents for M2S060T-1FGG676

M2S060T-1FGG676

Soc System On Chip Overview

The M2S060T-1FGG676 is a SmartFusion2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM Cortex-M3 microcontroller subsystem with a 56,520 Logic Element (LE) FPGA fabric. The device operates at a maximum clock frequency of 166 MHz and features 256 kB of program memory and 64 kB of data RAM. It utilizes a 676-ball FBGA package with 425 I/O pins. Electrical specifications include a core supply voltage of 1.2 V and a commercial operating temperature range of 0°C to +85°C.

Soc System On Chip Feature Summary

  • Integrates ARM Cortex-M3 processor with 56,520 LEs
  • Includes 256 kB program memory and 64 kB data RAM
  • Supports up to 166 MHz operation speed
  • Available in 676-ball FBGA package

Soc System On Chip Applications

  • Industrial control systems requiring real-time processing
  • Automotive embedded applications
  • Secure communication interfaces

Soc System On Chip Procurement Notes

Verify the specific ordering suffix against official Microchip documentation to confirm temperature grade and package details. Confirm export compliance requirements as this product may require additional documentation for shipment from the United States. Check current availability status directly with authorized distributors or the manufacturer.

Soc System On Chip Selection Notes

Select this component when a combined MCU and FPGA solution is required within the SmartFusion2 family. Ensure the design accommodates the 676-pin BGA footprint and meets the thermal resistance requirements for the FG676 package. Validate that the 56,520 LE density and 256 kB memory meet system constraints.

Soc System On Chip Part Context

This part belongs to the SmartFusion2 SoC FPGA series, which combines low-power flash technology with an integrated microcontroller subsystem. It shares the same physical package and pinout compatibility with other devices in the M2S0xxT-1FGG676 lineup, differing primarily in logic density and memory capacity.

Soc System On Chip Replacement Considerations

Compatible replacements within the same family include M2S025T-1FGG676 and M2S090T-1FGG676. These parts share the same package and interface capabilities but offer different logic element counts and memory sizes.

M2S060T-1FGG676M2S060T-1FGG676
$147.13
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