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M2S090-FGG676 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 676FBGA. Review the specifications below when checking this part for your BOM.
The M2S090-FGG676 is a SmartFusion2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM Cortex-M3 microcontroller subsystem with a 90K logic element FPGA fabric. The device features 512 kB of program memory and 64 kB of data RAM, operating at a maximum clock frequency of 166 MHz. It utilizes a 676-ball FBGA package (27x27 mm) with 425 I/Os. Electrical specifications include a core supply voltage of 1.2 V and a commercial operating temperature range of 0°C to +85°C.
Verify the specific ordering suffix against the manufacturer's current datasheet DS00004750F to confirm temperature grade and package details. Confirm RoHS compliance status as it varies by revision. Check for export control classifications such as ECCN 3A991D before procurement.
Select this model for designs requiring integrated MCU capabilities alongside FPGA logic. Ensure the design supports the 1.2V core voltage and appropriate I/O bank voltages. Verify thermal requirements against the junction-to-ambient resistance values provided in the datasheet for the FG676 package.
This component belongs to the SmartFusion2 family, which combines flash-based FPGA technology with a hard ARM Cortex-M3 core. It is designed for applications needing low power consumption and high security through embedded non-volatile memory.
Compatible devices within the same density class include the M2S090T-1FGG676I for industrial temperature ranges. Cross-family replacements like IGLOO2 FPGAs lack the integrated MSS and require different configuration approaches.
The maximum operating junction temperature for the commercial grade M2S090-FGG676 is 85°C.
Yes, the SmartFusion2 family integrates up to four PCI Express Gen 2 endpoints.
The M2S090-FGG676 contains approximately 90,000 Logic Elements (LEs).
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