M2S090TS-1FG676

Soc System On Chip Overview

The M2S090TS-1FG676 is a SmartFusion2 System-on-Chip FPGA from Microchip Technology, featuring an ARM Cortex-M3 processor and 86K logic elements. It operates within a junction temperature range of 0°C to 85°C (Commercial grade) with a typical core supply voltage of 1.2V. The device integrates embedded nonvolatile memory (eNVM), including 512 kB of flash and 64 kB of SRAM, alongside high-speed SerDes interfaces. Packaged in a 676-ball FBGA, it supports up to 425 I/Os and includes hard DDR3 controllers.

Soc System On Chip Feature Summary

• Integrated ARM Cortex-M3 microcontroller subsystem with Ethernet, USB, and CAN peripherals
• 86K Logic Elements with low-power flash technology for instant-on operation
• Embedded Nonvolatile Memory: 512 kB Flash and 64 kB SRAM
• High-performance SerDes interfaces with hard DDR3 memory controller support

Soc System On Chip Applications

• Industrial control systems requiring real-time processing and secure boot
• Automotive infotainment and gateway applications
• Medical equipment with strict reliability requirements
• Telecommunications infrastructure nodes

Soc System On Chip Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet DS00004750F to confirm package dimensions and temperature grade. Ensure compliance with export regulations as this product may require additional documentation for international shipping. Confirm RoHS status and moisture sensitivity level prior to procurement.

Soc System On Chip Selection Notes

Select this component for designs requiring a combination of FPGA fabric flexibility and MCU-based control. The 'TS' designation indicates data security features. Ensure the design accounts for the 1.2V core voltage and appropriate VPP charge pump supplies. Verify thermal management capabilities given the junction-to-air thermal resistance values provided in the datasheet.

Soc System On Chip Part Context

This part belongs to the SmartFusion2 family, which bridges the gap between traditional FPGAs and ASICs by integrating a hardened processor subsystem. It shares the same physical package and pinout compatibility with other devices in the 676-FBGA form factor within the SmartFusion2 and IGLOO2 families, facilitating board-level reuse across different density options.

Soc System On Chip Replacement Considerations

Direct pin-compatible replacements within the same package include other densities in the SmartFusion2 series such as M2S060TS or M2S150TS, provided the logic element count meets design requirements. Cross-family replacement with IGLOO2 devices requires verification of the missing MSS (Microcontroller Subsystem) features.