M2S090TS-FCS325I

Soc System On Chip Overview

The M2S090TS-FCS325I is a SmartFusion2 System-on-Chip FPGA from Microchip Technology, featuring an ARM Cortex-M3 processor and 86K logic elements. It integrates hard peripherals including Ethernet, USB, and CAN controllers, alongside up to 16 SerDes lanes and PCIe Gen 2 endpoints. The device utilizes low-power flash technology for non-volatile configuration and includes SECDED error correction for embedded SRAM. Operating at a maximum clock frequency of 166 MHz, it supports a core voltage of 1.2 V and operates within a commercial temperature range of 0°C to +85°C in a 325-ball FCBGA package.

Soc System On Chip Feature Summary

• Integrates ARM Cortex-M3 microcontroller subsystem with 166 MHz processing capability
• Features 86K logic elements, 5 Mb SRAM, and 4 Mb eNVM on a single chip
• Includes hard IP blocks for DDR3 memory controllers, PCIe Gen 2, and high-speed SerDes interfaces
• Provides enhanced security with AES-256, SHA-256, and Single Error Correction Double Error Detection (SECDED) for memory

Soc System On Chip Applications

• Industrial automation systems requiring IEC 61508 compliance
• Avionics and aerospace applications needing SEU immunity and DO-254/DO-178B standards support
• Medical devices demanding high reliability and data integrity
• Communication infrastructure utilizing PCIe and Ethernet connectivity

Soc System On Chip Procurement Notes

Verify the specific ordering suffix against the manufacturer's current documentation to confirm package type and temperature grade. Confirm export control classification (ECCN 3A991D) requirements prior to purchase. Ensure that power supply sequencing adheres to the recommended operating conditions specified in the datasheet to maintain device reliability.

Soc System On Chip Selection Notes

Select this component when a combination of FPGA fabric and embedded microcontroller functionality is required. The 'TS' designation indicates data security features including digest verification. Verify that the 325-ball FCBGA package dimensions fit the target PCB layout. Ensure the design accounts for the thermal resistance characteristics provided for the FCS325 package under expected airflow conditions.

Soc System On Chip Part Context

This part belongs to the SmartFusion2 family, which bridges the gap between traditional FPGAs and microcontrollers. It is designed for applications requiring secure, reliable, and low-power operation. The device complements the IGLOO2 FPGA family by adding the integrated MSS, making it suitable for complex control and interface tasks within a single silicon die.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same density and package are limited. Consider the M2S090T-FCS325I if data security features are not required, or the M2S090-FCS325I for industrial temperature grades. Cross-family migration to PolarFire or IGLOO2 requires significant architectural redesign.