M2S150-1FCG1152I

Soc System On Chip Overview

The M2S150-1FCG1152I is a SmartFusion 2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM Cortex-M3 microcontroller subsystem with a 146,124 Logic Element FPGA fabric in a 1152-pin FCBGA package. The device operates within a junction temperature range of -40°C to 100°C for industrial applications and supports a core supply voltage (VDD) of 1.14V to 1.26V. Key electrical specifications include a maximum operating frequency of 166 MHz for the MSS and support for high-speed serial interfaces.

Soc System On Chip Feature Summary

• Integrates a low-power real-time ARM Cortex-M3 Microcontroller Subsystem (MSS) with up to 146K Logic Elements.
• Features embedded nonvolatile memory (eNVM) providing 20-year data retention at elevated temperatures.
• Supports multiple I/O standards including LVDS, LVCMOS, and differential signaling across MSIO, MSIOD, and DDRIO banks.
• Includes integrated hard DDR3 memory controllers with error correction and high-performance SerDes lanes.

Soc System On Chip Applications

• Industrial automation systems requiring secure, low-power processing.
• Aerospace and defense applications utilizing radiation-tolerant flash technology.
• Test and measurement equipment needing high-density programmable logic.
• Medical devices requiring reliable embedded control and connectivity.

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' confirms the Industrial temperature grade (-40°C to 100°C). Confirm the '1' speed grade matches timing requirements. Check export control status as this product may require additional documentation for export from the United States. Ensure ESD handling procedures are followed during assembly.

Soc System On Chip Selection Notes

Select this part when both a hardened processor core and significant FPGA fabric density are required in a single chip. Compare against IGLOO 2 devices if no processor is needed, or PolarFire SoC if RISC-V architecture is preferred. Validate thermal resistance (θJA) calculations for the FCBGA-1152 package under expected power dissipation conditions.

Soc System On Chip Part Context

This component belongs to the SmartFusion 2 family, which combines FlashFPGA technology with an ARM Cortex-M3 core. It is distinct from the IGLOO 2 family, which lacks the integrated MSS but shares similar FPGA fabric characteristics. The M2S150 variant represents the highest density option in the initial SmartFusion 2 lineup.

Soc System On Chip Replacement Considerations

Parametric equivalents listed include M2S150T-1FCG1152I and M2S150TS-1FCG1152I. Verify that any replacement maintains the same package footprint and pinout compatibility. Ensure the alternative part number supports the required industrial temperature range and security features.