M55302/193A122Y

Headers, Male Pins Overview

The M55302/193A122Y is a rectangular MIL-DTL-55302 connector from the AirBorn W Series, manufactured by Molex. It features 122 positions arranged in three rows with a 2.54 mm pitch. The component utilizes gold-plated copper alloy contacts and a Polyphenylene Sulfide (PPS) housing. Designed for PCB mounting with solder termination, it operates within a temperature range of -65°C to +125°C and maintains an insulation resistance of 5 GOhms.

Headers, Male Pins Feature Summary

• High-density interconnect capability with 122 positions across three rows
• Gold-plated copper alloy contacts for reliable signal transmission
• Polyphenylene Sulfide (PPS) housing material for thermal stability

Headers, Male Pins Applications

• Military and aerospace electronic systems
• Ruggedized communication equipment
• Avionics control modules

Headers, Male Pins Procurement Notes

Verify the specific manufacturer lot traceability and RoHS compliance status directly with Molex or authorized distributors. Confirm that the part number matches the exact military specification requirements for your application environment before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when high pin density is required in a compact rectangular form factor. Ensure the PCB layout supports the 2.54 mm pitch and three-row configuration. Verify that the operating temperature range meets the environmental demands of the target installation site.

Headers, Male Pins Part Context

This part belongs to the AirBorn W Series, designed for demanding environments requiring robust electrical connections. The M55302 designation indicates compliance with MIL-DTL-55302 standards, ensuring reliability in critical applications where standard commercial connectors may not suffice.

Headers, Male Pins Replacement Considerations

Cross-reference with other M55302 series variants for position count and row configuration compatibility. Verify mechanical dimensions and contact plating specifications to ensure interchangeability without redesigning the host assembly.