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M55302/57B40Y is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is M55302/57B40Y. Review the specifications below when checking this part for your BOM.
The M55302/57B40Y is a rectangular military specification connector from the AirBorn W Series, manufactured by Molex. It features 40 positions arranged in two rows with a 2.54 mm pitch. The component utilizes gold-plated copper contacts and a polyphenylene sulfide (PPS) housing. Designed for right-angle PCB mounting via solder termination, it operates within a temperature range of -65°C to +125°C. This MIL-DTL-55302 compliant part provides reliable interconnection for demanding applications.
Verify current availability status directly with Molex or authorized distributors, as supply chain conditions for military-grade components fluctuate. Confirm that the specific suffix matches the required contact configuration and mounting style. Request manufacturer certificates of compliance to ensure adherence to MIL-DTL-55302 standards before finalizing procurement orders.
Select this connector when a right-angle, two-row MIL-spec interface is required. Ensure the 2.54 mm pitch aligns with the PCB footprint. Verify that the operating environment stays within the specified -65°C to +125°C range. Confirm compatibility with mating plugs regarding contact gender and locking mechanisms typical of the W Series.
This part belongs to the AirBorn W Series, a family of high-density rectangular connectors known for push-pull locking. The M55302 designation indicates compliance with the MIL-DTL-55302 standard. As a Molex company product, it maintains heritage performance standards while benefiting from modern manufacturing capabilities for defense and aerospace sectors.
Cross-reference with other M55302/57 variants having identical position counts and row configurations. Verify mechanical dimensions and pinout assignments against existing designs. Ensure mating connectors share the same series and locking mechanism type to maintain system integrity.
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