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M55302/58-B36X is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is M55302/58-B36X. Review the specifications below when checking this part for your BOM.
The M55302/58-B36X is a rectangular MIL-DTL-55302 connector from the AirBorn W Series, manufactured by Molex. It features a 36-position, two-row receptacle configuration with a 2.54 mm pitch. The component utilizes gold-plated copper alloy sockets and terminates via solder connections for PCB mounting. Constructed with polyphenylene sulfide (PPS) housing, it supports a current rating of 5 A and operates within a temperature range of -65°C to +125°C.
Verify the specific suffix 'B36X' against official Molex/AirBorn documentation to confirm exact contact arrangement and termination style. Ensure compatibility with mating plugs and verify that the gold plating thickness meets project requirements. Confirm availability status directly with the manufacturer as distribution channels may vary.
Select this component when a 36-position, two-row MIL-DTL-55302 compliant connector is required. It is suitable for applications demanding high reliability in harsh environments. Consider the 2.54 mm pitch and solder termination method during PCB layout design. Verify that the 5 A current rating and operating temperature range align with system electrical and thermal constraints.
This part belongs to the AirBorn W Series, a line of high-performance rectangular connectors designed for demanding applications. The series is known for its robust construction and compliance with stringent military standards. As a Molex company product, it integrates advanced engineering for durability and consistent performance in critical electronic interconnections.
Check for direct cross-reference part numbers from Molex/AirBorn or other qualified MIL-DTL-55302 suppliers. Ensure any substitute matches the 36-position count, 2.54 mm pitch, and socket type. Verify identical environmental ratings and termination methods before integration.
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