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M55302/58-B50F is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is M55302/58-B50F. Review the specifications below when checking this part for your BOM.
The M55302/58-B50F is a rectangular MIL-DTL-55302 series connector manufactured by AirBorn, a Molex company. It is classified as a receptacle with 50 positions arranged in two rows. The component utilizes solder termination for PCB mounting and features female socket contacts plated with gold. Constructed from copper alloy contacts and polyphenylene sulfide (PPS) housing, it supports a current rating of 5 A and operates within a temperature range of -65 C to +125 C. The connector maintains an insulation resistance of 5 GOhms and employs a 2.54 mm pitch.
Verify the specific manufacturer lot traceability and compliance documentation required for your procurement process. Confirm that the component meets all necessary environmental certifications for your intended deployment. Ensure compatibility with existing mating connectors within the system architecture before finalizing orders.
Select this component when a 50-position, two-row receptacle is required for MIL-DTL-55302 compliant designs. Consider the 2.54 mm pitch and PCB mount style for board layout constraints. Evaluate the 5 A current rating and PPS housing properties against the operational thermal and electrical demands of the application.
This part belongs to the AirBorn W Series, designed for robust interconnect solutions. As a MIL-DTL-55302 type connector, it adheres to strict government standards for performance and durability. The series offers various position counts and contact configurations to support diverse high-density connectivity needs in critical infrastructure.
Direct substitutes must match the MIL-DTL-55302 specification, 50-position count, two-row arrangement, and female socket contact type. Verify identical pinout configurations and mechanical dimensions to ensure interchangeability without redesigning the host assembly.
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