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M55302/58LB24F is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is M55302/58LB24F. Review the specifications below when checking this part for your BOM.
The M55302/58LB24F is a rectangular MIL-DTL-55302 receptacle from the AirBorn W Series. It features 24 positions in a 2-row configuration with a 2.54 mm pitch. The component utilizes copper alloy contacts with gold plating and a glass-filled polyphenylene sulfide housing. Designed for PCB mount, it employs a DIP solder termination method. Rated for 5 A current, it operates within a temperature range of -65°C to +125°C and maintains an insulation resistance of 5 GOhms.
Verify that the specific part number matches the required MIL-DTL-55302 standard and W Series designation. Confirm the 24-position count and two-row layout align with the target PCB footprint. Ensure the dip solder termination type is compatible with the assembly process. Validate the operating temperature range requirements against the specified -65°C to +125°C limits before finalizing procurement.
Select this component when a flight-heritage connector is required for critical environments. The choice is driven by the need for MIL-DTL-55302 compliance and robust construction. Consider the 2.54 mm pitch and 24-position density for space-constrained designs. The gold-plated contacts and PPS housing provide necessary durability for harsh operational conditions compared to commercial alternatives.
This receptacle belongs to the AirBorn W Series, a line of field-proven connectors known for use in aerospace and defense sectors. The series is characterized by its adherence to strict military standards and reliability in extreme environments. As a Molex company product, it integrates established manufacturing quality with specialized rugged design principles for mission-critical electronic interconnections.
Direct substitutes must match the MIL-DTL-55302 specification, 24-position count, and 2.54 mm pitch. Verify compatibility regarding the dip solder termination and female socket gender. Cross-reference housing material properties and temperature ratings to ensure equivalent performance in the intended application environment.
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