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The M55302/58LC70X is a rectangular MIL-Spec connector from the AirBorn W Series, manufactured by Molex. It features a 60-position, 2-row receptacle configuration with solder termination for PCB mounting. The unit utilizes gold-plated copper alloy sockets and a polyphenylene sulfide (PPS) housing. Electrical specifications include a 5 A current rating, 5 GOhms insulation resistance, and a 2.54 mm pitch. It operates within a temperature range of -65°C to +125°C and complies with MIL-DTL-55302 standards.
Verify the specific suffix codes against official Molex/AirBorn documentation to confirm exact pin count, contact plating thickness, and mating compatibility. Ensure the procurement order matches the precise MIL-DTL-55302 revision requirements for your application. Cross-reference part numbers with authorized distributors to avoid counterfeit components.
Select this component when strict adherence to MIL-DTL-55302 standards is mandatory for the system design. The 2.54 mm pitch and 60-position layout suit applications requiring high I/O density on a single PCB row. Evaluate the -65°C to +125°C operating range against environmental conditions to ensure long-term reliability under thermal stress.
This connector belongs to the AirBorn W Series, designed for high-reliability interconnect solutions. As a Molex company product, it integrates advanced manufacturing processes to meet stringent defense industry requirements. The series is characterized by its robust construction and consistent performance in critical mission-critical electronics.
Direct substitutes must match the MIL-DTL-55302 specification, 60-position count, and 2.54 mm pitch. Verify that alternative parts maintain identical socket type, gold plating, and PPS housing material to ensure mechanical and electrical interchangeability without redesigning the PCB footprint.