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M55302/60-B120H is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is M55302/60-B120H. Review the specifications below when checking this part for your BOM.
The M55302/60-B120H is a rectangular MIL-DTL-55302 connector from the AirBorn W Series, manufactured by Molex. It features a 120-position configuration with two rows and a 2.54 mm pitch. The receptacle utilizes gold-plated copper alloy sockets for reliable signal transmission. Designed for PCB mounting in straight orientation, it operates within a temperature range of -65°C to +125°C. The housing is constructed from Polyphenylene Sulfide (PPS), providing high insulation resistance of 5 GOhms and supporting a current rating of 5 A.
Verify the specific manufacturer lot traceability and compliance with MIL-DTL-55302 standards before integration. Confirm that the supplier provides official documentation regarding the component's environmental testing results. Ensure the procurement channel is authorized to guarantee authenticity and prevent counterfeit components from entering the supply chain.
Select this part when a high-contact-count interface is required within strict spatial constraints. The 2.54 mm pitch allows compatibility with standard board layouts while maintaining signal integrity. Consider the straight mounting style for direct panel or board connections where right-angle configurations are unsuitable for the mechanical design.
This component belongs to the AirBorn W Series, which specializes in rectangular military specifications. The series offers various row options and contact counts to support diverse density requirements. As a MIL-DTL-55302 compliant device, it meets rigorous government standards for performance and consistency in defense and aerospace sectors.
Direct substitutes include other M55302/60 variants with matching position counts and pin assignments. Verify that any alternative maintains the same 2.54 mm pitch and gold plating specifications to ensure interchangeability without redesigning the mating interface.
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