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M55302/61B56 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is M55302/61B56. Review the specifications below when checking this part for your BOM.
The M55302/61B56 is a rectangular MIL-DTL-55302 series connector manufactured by AirBorn, a Molex company. It is classified as a plug with 56 positions arranged in two rows. The component features male pin contacts made of copper alloy with gold plating, designed for solder termination. It utilizes a right-angle free-hanging mounting style and incorporates a polyphenylene sulfide (PPS) shell. The connector supports a wire gauge of 22 AWG and operates within a temperature range of -65°C to +125°C.
Verify the specific manufacturer part number against official AirBorn or Molex documentation to ensure compliance with current revision standards. Confirm that the procurement source provides traceability certificates required for military-grade components. Ensure the supplier can validate the authenticity of the MIL-DTL-55302 designation before finalizing acquisition.
Select this model when a high-density interconnect solution is required for space-constrained military applications. The right-angle configuration facilitates efficient cable routing in tight enclosures. Verify that the 56-position capacity aligns with system interface requirements and that the solder termination method matches the assembly process capabilities.
This component belongs to the AirBorn W Series, a line of connectors designed for demanding environments. The M55302 designation indicates adherence to specific military dimensional and performance standards. As a product of AirBorn, now part of Molex, it integrates established reliability protocols with modern manufacturing processes for consistent quality in critical infrastructure.
Cross-reference compatible substitutes using official AirBorn cross-reference guides. Verify that any alternative maintains identical MIL-DTL-55302 compliance, contact configuration, and environmental ratings to ensure seamless integration without redesign.
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