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M55302/61B70 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is M55302/61B70. Review the specifications below when checking this part for your BOM.
The M55302/61B70 is a rectangular MIL-DTL-55302 connector from the AirBorn W Series, manufactured by Molex. It features 70 positions arranged in two rows with a 2.54 mm pitch. The component utilizes male pin contacts made of copper alloy with gold plating. Designed for through-hole termination, it offers right-angle mounting. The housing is constructed from Polyphenylene Sulfide (PPS). Electrical specifications include an insulation resistance of 5 GOhms and an operating temperature range from -65 C to +125 C.
Verify current availability directly with Molex or authorized distributors, as lead times may vary. Confirm RoHS compliance status and specific manufacturing lot details upon request. Ensure the ordering suffix matches the required contact configuration and termination style. Cross-reference the manufacturer part number against official datasheets to avoid substitution errors during procurement.
Select this model for applications requiring high-density interconnects in constrained spaces. The 2.54 mm pitch allows for compact board layouts while maintaining robust mechanical integrity. Right-angle mounting facilitates efficient cable routing in enclosed chassis designs. Verify that the 70-position count aligns precisely with system wiring requirements before finalizing the design.
This component belongs to the AirBorn W Series, a line of connectors designed for demanding environments. The series is characterized by its compliance with strict military standards, ensuring durability and consistent performance. Molex acquired AirBorn, integrating these specialized connectors into their broader portfolio of high-performance interconnect solutions.
Compatible substitutes within the same MIL-DTL-55302 specification should be evaluated based on identical position counts and pitch dimensions. Ensure any alternative maintains the same contact material and plating thickness for equivalent electrical performance. Verify mechanical compatibility regarding mounting flange and hole patterns.
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