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M55302/63B10H is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is M55302/63B10H. Review the specifications below when checking this part for your BOM.
The M55302/63B10H is a rectangular MIL-DTL-55302 connector from the AirBorn W Series, manufactured by Molex. It features a 10-position, 2-row configuration with male pin contacts. The component utilizes gold-plated copper alloy contacts and a polyphenylene sulfide (PPS) housing. Designed for through-hole termination, it offers a right-angle mounting style suitable for PCB integration. The unit supports an operating temperature range of -65°C to +125°C and maintains an insulation resistance of 5 GOhms.
Verify current manufacturing status directly with Molex or authorized distributors, as lifecycle information may vary. Confirm that the specific ordering suffix matches the required contact plating and housing material variants. Ensure compatibility with mating receptacles within the same W Series family to guarantee proper electrical and mechanical engagement during assembly.
Select this part when a right-angle, 10-pin male header is required for MIL-DTL-55302 compliant designs. Consider the 1.27 mm pitch and two-row layout for density requirements. Validate that the through-hole soldering process aligns with the board's thermal profile and that the right-angle orientation fits the enclosure constraints without interference.
This component belongs to the AirBorn W Series, a line of high-performance rectangular connectors designed for demanding applications. The series is known for its durability and compliance with stringent military standards. The M55302 designation indicates adherence to specific dimensional and performance criteria defined in the governing military specification document.
Cross-reference with other M55302/63B10H variants from different manufacturers if supply is constrained. Verify that substitute parts maintain identical pinout, pitch, and mounting dimensions to ensure interchangeability without redesigning the printed circuit board or enclosure.
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