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M55302/63B30H is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is M55302/63B30H. Review the specifications below when checking this part for your BOM.
The M55302/63B30H is a rectangular MIL-Spec connector from the AirBorn W Series, manufactured by Molex. It features 30 positions in a two-row configuration with a 2.54 mm pitch. The component utilizes gold-plated copper alloy contacts and a Polyphenylene Sulfide (PPS) housing. Designed for through-hole board mount installation, it offers a straight orientation. Electrical specifications include a 5 A current rating and 1 kV voltage rating. Operating temperatures range from -65 C to +125 C, with an insulation resistance of 5 GOhms.
Verify manufacturing status directly with Molex/AirBorn as lifecycle information may be unspecified. Confirm RoHS compliance details prior to integration. Ensure compatibility with existing PCB layouts due to specific mounting flange requirements. Cross-reference official datasheets for precise dimensional tolerances before finalizing procurement orders.
Select this model for applications demanding strict adherence to MIL-DTL-55302 specifications. The 2.54 mm pitch suits standard density requirements. Verify that the straight board mount style aligns with chassis constraints. Consider the 1 kV rating for high-voltage isolation needs within the system architecture.
This part belongs to the AirBorn W Series, known for high-density rectangular connectors. It serves as a specialized variant within the MIL-DTL-55302 family, tailored for board-to-board or cable-to-board connections in critical infrastructure. The designation reflects specific contact count and plating configurations unique to this identifier.
WB80SD9/12 is listed as an alias for this component. Verify exact pinout and mechanical dimensions against original design files before substitution.
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