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M55302/63B50X is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is M55302/63B50X. Review the specifications below when checking this part for your BOM.
The M55302/63B50X is a rectangular MIL-DTL-55302 qualified connector from the AirBorn W Series. It features a straight mounting angle and utilizes copper alloy contacts with gold plating for reliable signal transmission. The housing is constructed from Polyphenylene Sulfide (PPS), providing durability in harsh environments. Rated for 5 A current, it operates within a temperature range of -65°C to +125°C. This component supports high-density interconnects with up to 604 contacts across 2-6 rows, ensuring robust performance in mission-critical aerospace and defense applications.
Verify the specific contact count and row configuration against the official datasheet before procurement, as the W Series offers variable configurations. Confirm that the suffix 'X' aligns with your required termination style and mating interface specifications. Ensure environmental ratings meet the operational requirements of the target application environment.
Select this model when high pin counts and strict MIL-DTL-55302 compliance are necessary. The W Series is optimized for flexible circuit integration and space-constrained designs. Evaluate the thermal and current load requirements against the 5 A rating to ensure adequate safety margins for the intended electrical load.
This part belongs to the AirBorn W Series, a line of rectangular PCB connectors designed for high-reliability applications. The series is known for its ability to save time and reduce costs in manufacturing while maintaining performance in demanding aerospace and defense sectors. It complements other variants in the MIL-C-55302 family by offering specific density and mounting options.
Compatible substitutes include other M55302/63B50X variants or equivalent MIL-DTL-55302 connectors from the same manufacturer. Verify mechanical dimensions and contact arrangements to ensure interchangeability without redesigning the host board.
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