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M55302/63C70Y is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is M55302/63C70Y. Review the specifications below when checking this part for your BOM.
The M55302/63C70Y is a rectangular MIL-Spec connector from the AirBorn W Series, manufactured by Molex. It features 70 positions arranged in two rows with a 2.54 mm pitch. The component utilizes solder termination and PCB mount installation style. Contacts are male pins made of copper alloy with gold plating. The housing is constructed from Polyphenylene Sulfide (PPS). Electrical ratings include a current capacity of 5 A and an insulation resistance of 5 GOhms. Operating temperature ranges from -65 C to +125 C.
Verify current availability status directly with the manufacturer or authorized distributors, as supply chain fluctuations may affect lead times. Confirm RoHS compliance documentation and specific manufacturing lot dates if required for your project's quality assurance standards. Ensure that the ordering suffix matches the exact configuration needed for your assembly requirements.
Select this part for applications requiring high-density interconnects within strict military environmental constraints. The 2.54 mm pitch allows for compact board layouts while maintaining robust mechanical integrity. Consider the right-angle mounting option if space limitations dictate non-linear routing paths on the printed circuit board.
This component belongs to the AirBorn W Series, a line of connectors designed for demanding environments. The series offers various position counts and termination styles to support diverse electronic integration needs. As a MIL-DTL-55302 type connector, it ensures compatibility with established defense industry standards and legacy system architectures.
Cross-reference with other MIL-DTL-55302 compliant parts from different manufacturers if AirBorn stock is unavailable. Verify that substitute components match the critical dimensions, contact arrangement, and electrical ratings to ensure functional interchangeability without redesigning the host assembly.
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