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M74HC173RM13TR is listed in the Flip Flops range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IC FF D-TYPE SNGL 4BIT 16SOP. Review the specifications below when checking this part for your BOM.
The M74HC173RM13TR is a quad D-type register with 3-state outputs manufactured by STMicroelectronics. It belongs to the HC logic series and utilizes CMOS technology. The component is housed in a 16-pin SOIC package. It operates within a supply voltage range of 2V to 6V. The device supports a maximum operating temperature of 125°C and a minimum of -40°C. It features positive edge triggering for data latching.
Verify the specific suffix RM13TR against official STMicroelectronics documentation to confirm packaging and reel specifications. Ensure compatibility with existing design parameters before integration. Cross-reference the manufacturer part number with authorized distributor catalogs to validate authenticity and current availability status. Confirm RoHS compliance requirements match project standards.
Select this component when a quad D-type register with three-state outputs is required for high-speed digital applications. The HC series offers compatibility with standard TTL levels while maintaining CMOS advantages. Consider the 16-pin SOIC package constraints for PCB layout. Evaluate the operating temperature range against environmental conditions to ensure reliable performance across the specified industrial limits.
This part belongs to the M74HC173 family of digital logic integrated circuits. It serves as a fundamental building block for sequential logic designs. The device complements other HC series components like inverters and gates. It is designed for use in general-purpose digital systems requiring reliable data storage and transfer capabilities within standard voltage ranges.
Compatible substitutes include the M74HC574RM13TR for similar functionality with different pinout considerations. The M74HC374RM13TR offers comparable quad D-type operations. Verify electrical characteristics and package dimensions before substitution to maintain circuit integrity.
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