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M74HC175RM13TR is listed in the Flip Flops range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IC FF D-TYPE SNGL 4BIT 16SOP. Review the specifications below when checking this part for your BOM.
The M74HC175RM13TR is a quad D-type flip-flop manufactured by STMicroelectronics, belonging to the 74HC logic series. It features positive-edge triggering and includes a clear input for asynchronous reset functionality. The device operates within a supply voltage range of 2V to 6V and supports data rates up to 90 MHz. It is housed in a 16-pin SOIC package with a width of 3.90mm. The component is rated for an operating temperature range of -55°C to 125°C and complies with RoHS3 standards.
This specific part number is officially classified as obsolete and no longer manufactured by STMicroelectronics. Procurement should focus on identifying verified direct substitutes or alternative manufacturers offering equivalent pin-compatible components. Verify that replacement parts meet the same electrical specifications, including voltage ranges, speed ratings, and package dimensions, to ensure seamless integration into existing designs without modification.
Select this component when a quad D-type flip-flop with asynchronous clear functionality is required for high-speed digital logic applications. Ensure the design environment supports the 2V to 6V operating range and the -55°C to 125°C temperature specification. Consider the 16-SOIC package constraints for PCB layout. Due to its obsolete status, prioritize alternatives with identical logical functions and electrical characteristics to maintain system reliability and performance consistency.
The M74HC175RM13TR belongs to the widely adopted 74HC family of CMOS logic integrated circuits, known for high-speed operation and wide voltage flexibility. This specific variant implements four independent D-type flip-flops in a single package, providing efficient space utilization for complex sequential logic designs. The RM13 suffix indicates the tape-and-reel packaging format suitable for automated surface-mount assembly processes.
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