M74HC533B1R

Latches Overview

The M74HC533B1R is an octal D-type latch with transparent 3-state and inverse outputs, fabricated using high-speed CMOS C2MOS technology. It features 8 channels for data storage and bus-oriented latching. The device operates within a supply voltage range of 2V to 6V. It is housed in a 20-DIP package with through-hole mounting. The component supports standard logic functions and includes tri-state outputs for efficient bus management.

Latches Feature Summary

• Octal D-type latch architecture with transparent 3-state outputs
• High-speed CMOS C2MOS fabrication technology
• Bus-oriented data latching capability with inverse outputs

Latches Applications

• Bus-oriented data latching systems
• Convenient data storage applications
• Digital logic circuits requiring tri-state control

Latches Procurement Notes

Verify component authenticity and datasheet alignment before integration. Confirm package type and pinout compatibility with existing PCB layouts. Check RoHS compliance status for regulatory adherence. Ensure supply chain stability as the part may have limited availability or obsolescence risks.

Latches Selection Notes

Select this component for designs requiring octal latching with tri-state output control. Consider the 2V to 6V operating range for power supply compatibility. Evaluate the 20-DIP package for through-hole assembly requirements. Compare performance against similar HC series latches if specific timing parameters are critical.

Latches Part Context

The M74HC533B1R belongs to the STMicroelectronics M74HC series of high-speed CMOS logic devices. It is functionally related to the M74HC373 but provides inverse outputs. This series utilizes silicon gate C2MOS technology for enhanced speed and low power consumption compared to older logic families.

Latches Replacement Considerations

Direct substitutes include other octal D-type latches with 3-state outputs from compatible logic families. Verify pinout and electrical specifications match before substitution. Alternative packages may require adapter solutions if form factor changes are acceptable.