M74HCT125RM13TR

Overview

The M74HCT125RM13TR is a high-speed CMOS quad bus buffer with three-state outputs, manufactured using silicon gate C2MOS technology. It operates within a supply voltage range of 4.5V to 5.5V and supports an operating temperature from -55°C to 125°C. The device features balanced propagation delays (tPLH ≅ tPHL) and symmetrical output impedance with |IOH| = IOL = 6mA minimum. At VCC = 4.5V, the typical propagation delay is 13ns. Quiescent supply current is 4μA maximum at 25°C. Inputs are TTL-compatible with VIH = 2.0V minimum and VIL = 0.8V maximum.

Feature Summary

• High-speed CMOS quad bus buffer with three-state outputs fabricated in silicon gate C2MOS technology
• Directly interfaces HSC2MOS systems with TTL and NMOS components through compatible input thresholds
• Balanced propagation delays and symmetrical output impedance for reliable signal transmission
• All inputs equipped with protection circuits against static discharge and transient excess voltage

Applications

• Bus-oriented transmissions
• Clock buffering and distribution
• Memory data register applications

Procurement Notes

Verify component authenticity by checking manufacturer markings and datasheet alignment. Confirm package type matches SO-14 specifications. Ensure environmental compliance documentation is available. Validate that the ordering suffix RM13TR corresponds to tape and reel packaging. Cross-reference part numbers with official STMicroelectronics databases to avoid counterfeit products.

Selection Notes

Select this component when interfacing high-speed CMOS systems with TTL or NMOS logic families. Consider the 4.5V to 5.5V supply voltage requirement and -55°C to 125°C operating temperature range. Evaluate propagation delay characteristics for timing-sensitive designs. Verify pin compatibility with existing 74 series 125 footprints during PCB layout planning.

Part Context

This device belongs to the M74HCT125 family of quad bus buffers with three-state outputs. It is designed for direct interface between HSC2MOS systems and TTL/NMOS components. The product line includes various package options such as DIP, SOP, and TSSOP configurations. The specific RM13TR suffix indicates surface-mount tape and reel packaging suitable for automated assembly processes.

Replacement Considerations

Check for functional equivalents with identical pinouts and electrical characteristics. Verify supply voltage ranges and operating temperatures match design requirements. Ensure three-state control logic compatibility. Review mechanical dimensions for package interchangeability.