M80-4TE3042F3

Headers, Receptacles, Female Sockets Overview

The Harwin M80-4TE3042F3 is a Power to the Board connector in the DIL Extended Vertical Throughboard form factor. It features 30 positions (15+15 pins) with a 2.00mm pitch. The component is a female receptacle designed for through-hole mounting on printed circuit boards. It utilizes gold-plated contacts and includes guide pin functionality for precise alignment during mating.

Headers, Receptacles, Female Sockets Feature Summary

• Extended vertical height design for through-board termination
• Integrated guide pin system for accurate alignment
• Gold contact plating for reliable signal transmission

Headers, Receptacles, Female Sockets Applications

• High-density board-to-board interconnections
• Power distribution modules requiring robust connections
• Industrial equipment internal wiring systems

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific ordering suffix against the official Harwin datasheet to ensure correct pin count, plating type, and mechanical dimensions. Confirm that the extended vertical height matches the target PCB assembly requirements before finalizing procurement orders.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when high-density power or signal routing is required in a vertical orientation. The extended height accommodates specific board stack-up needs. Ensure the mating connector supports the guide pin interface for secure locking and alignment during assembly.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Harwin Datamate J-Tek series, known for compact, high-reliability interconnect solutions. The M80-4TE3042F3 specifically addresses applications needing vertical through-board connectivity with enhanced mechanical stability and electrical performance in confined spaces.

Headers, Receptacles, Female Sockets Replacement Considerations

Direct substitutes within the same family require matching the 30-position count, 2.00mm pitch, and vertical through-board configuration. Verify compatibility of the guide pin feature and contact plating specifications with existing mating hardware.