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The M80-5T11005ME is a Datamate J-Tek board connector manufactured by Harwin Inc. It features a male header configuration with 10 positions arranged in a dual in-line (DIL) layout across two rows. The component utilizes a 2.00mm pitch and is designed for vertical through-hole mounting on printed circuit boards. Contact materials include phosphor bronze with gold plating for mating surfaces, ensuring reliable electrical performance. The insulator is constructed from black glass-filled polyphenylene sulfide (PPS), providing structural integrity and thermal resistance.
Verify the specific ordering suffix to confirm contact finish thickness and insulator color variations. Ensure compatibility with corresponding female receptacles within the Datamate J-Tek series. Check RoHS compliance status against current regulatory requirements. Confirm lead time availability as manufacturing schedules may vary. Validate mechanical dimensions against PCB footprint specifications before procurement.
Select this component when a vertical male header with 10 positions and 2.00mm pitch is required. Consider the dual in-line layout for space-constrained applications needing high density. Evaluate the through-hole termination method against surface-mount alternatives. Assess the operating temperature range against environmental conditions. Verify mating force requirements against assembly tooling capabilities.
This part belongs to the Harwin Datamate J-Tek family of connectors, known for their robust locking mechanisms and compact form factor. The series supports various configurations including power and signal applications. The M80-5T11005ME specifically addresses needs for reliable vertical interconnects in demanding environments. Its design emphasizes durability and consistent electrical performance across cycles.
Direct substitutes within the same series require matching position count and pitch. Verify that alternative parts maintain identical locking features and terminal styles. Cross-reference mechanical drawings to ensure PCB footprint compatibility. Confirm that material specifications meet original equipment manufacturer requirements.