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The M80-5T13442MC is a Datamate J-Tek series header connector manufactured by Harwin Inc. It features a vertical through-hole mounting style with 34 positions arranged in two rows. The contact pitch is 0.079 inches (2.00mm). Contacts are male pins made of phosphor bronze, featuring tin/lead termination plating and gold mating surface plating. The insulator is black polyphenylene sulfide (PPS) reinforced with glass fiber, rated UL94 V-0. The connector utilizes a push-turn locking mechanism and includes keying slots and mating flanges for secure board-to-board or wire-to-board applications.
Verify the specific ordering suffix to ensure compatibility with required mating harnesses and backshells. Confirm that the tin/lead termination plating meets your assembly process requirements. Check for availability of complementary panel mount receptacles and jackscrews within the same Datamate J-Tek family to complete the system integration effectively.
Select this component when a vertical, latched header with 34 positions is required. Ensure the mating device matches the 2.00mm pitch and male pin configuration. Consider the thermal limits of the PPS material and the current rating constraints during circuit design. Verify that the PCB layout accommodates the specific footprint and locking mechanism dimensions provided in the official datasheet.
This part belongs to the Datamate J-Tek family, known for its compact size and high reliability. The M80-5T prefix indicates a vertical header variant. It is designed for harsh environments, offering superior vibration resistance compared to standard connectors due to its unique locking feature. The series supports various contact counts and configurations for diverse electronic packaging needs.
Direct substitutes must match the 2.00mm pitch, 34-position count, and vertical orientation. Compatible alternatives include other Harwin Datamate headers with identical locking mechanisms. Cross-brand replacements require careful verification of footprint dimensions and electrical ratings to ensure functional equivalence without redesigning the host PCB.