M80-5T22605B1

Overview

The M80-5T22605B1 is a vertical male header connector from the Harwin Datamate J-Tek series. It features a 26-position configuration with a 2.00 mm pitch, designed for through-hole termination. The housing is constructed from black Polyphenylene Sulfide (PPS) with UL94 V-0 flammability rating. Contacts are made of phosphor bronze with gold plating. This specific part includes an integrated backshell assembly.

Feature Summary

• Vertical board-to-board or board-to-wire interconnection design
• Integrated backshell for cable management and strain relief
• High-reliability locking mechanism via hex socket jackscrews
• Gold-plated contacts for corrosion resistance

Applications

• Industrial control systems requiring robust mechanical retention
• Automotive electronics harness connections
• Test and measurement equipment interfaces
• Aerospace wiring assemblies

Procurement Notes

Verify the presence of the integrated backshell in the final assembly drawing, as this variant differs from standard headers. Confirm that the mating receptacle utilizes the correct Datamate J-Tek keying to ensure proper alignment. Check for RoHS compliance status if environmental regulations apply to your specific deployment region.

Selection Notes

Select this component when a fixed vertical connection with built-in cable support is required. The integrated backshell eliminates the need for separate strain relief hardware. Ensure the mating interface supports the 2.00 mm pitch and that the application environment remains within the specified temperature range for PPS insulation.

Part Context

This connector belongs to the Datamate J-Tek family, known for high-density interconnects. The M80 prefix indicates the specific product line generation. The 'B1' suffix typically denotes the inclusion of the backshell assembly, distinguishing it from bare header variants like the M80-5102605.

Replacement Considerations

M80-5102605 serves as the base header without the backshell. Direct substitution requires verifying if the application can accommodate the missing backshell structure or if additional external strain relief is necessary.